Key ASIC has been offering design services and turnkey services since 2006, from the old 0.25um all the way down to 6nm process technology. The increasing complexity and functionality of today’s ASIC, SoC, IoT, and AI processors have brought out many more challenges than the traditional chip implementation. With 17 years of experience in IP, ASIC, SoC, IoT, and AI processors development and semiconductor manufacturing, Key ASIC is one the leading fabless design house that can help customers achieve their end target in a shorter time and lower investment.

At Key ASIC, we provide comprehensive ASIC/SoC/IoT/AI processor design services with a well-developed infrastructure and expertise in the industry. Our objective is to meet customers' chip design needs, accelerate their development process and deliver market proven silicon products in the shortest time and at the lowest cost. Key ASIC's professional ASIC/SoC/IoT/AI processor design and production (OEM) approach offers a flexible engagement model. Customer is able to gain control and ownership over the whole development process. Customers may contract Key ASIC's ASIC/SoC/IOT/AI processor turnkey services in whole or partially, without restrictions on business or volume size.

ASIC / SoC / IoT / AI processor Design Services:

●    FPGA-to-ASIC conversion

●    Chip architecture design & RTL coding

●    Spec-to-GDSII, RTL-to-GDSII, Netlist-to-GDSII

●    Design-for-test (DFT), JTAG, Scan, ATPG, Memory BIST

●    Hardening of digital/mixed-signal IP

●    Automated Place & Route

●    IP (GDSII) merge

●    Logic cells power/timing characterization

●    Customization/optimization of Logic cells

●    Circuit & Layout customization & optimization for Analog IPs

●    PDK development & validation

●    IP porting & validation

As design complexity increases, packaging and testing represent a significant portion of the overall chip cost. Key ASIC works closely with industry partners to provide a wide selection of advanced and cost effective package & test offerings, such as high-speed interface, low power dissipation greater choice and flexibility translate to minimum cost for our customers.

Package Options

Partnering with leading first and second tier packaging partners like ASE and OSE, Key ASIC provides a wide range of package turnkey solutions from complex System-in-Package (SiP), Multi-Chip Module (MCM),  Ball-Grid-Array (BGA) to the cost-sensitive legacy Quad Flat Pack (QFP) in order to satisfy customers' increasing demands for smaller sizes, more I/Os, and lower costs.

Testing Program and Test Environment

The test program and environment prepared for each ASIC prototype are developed and monitored carefully by a group of experienced in-house engineers. At the mass production stage when all of the settings of a test program are confirmed, the test program and the production documents are sent to our test partners to ensure accuracy before production begins. Only after careful verification will only the test program be formally released to our test partner. Various tester choices are supported for different performance/cost requirements through qualified outside partners who meet customers' capacity and cost objectives.