(Kuala Lumpur, July 1, 2025 )

Key ASIC Berhad (KLSE: KEYASIC) is proud to announce a major victory in the global AI semiconductor arena with the award of a RM13.1 million AI chip design contract from a leading technology company. This latest win reaffirms Key ASIC’s leadership position as a provider of high-performance, ultra-low power AI chips — critical building blocks for the next generation of smart, connected devices.

Fast-Track to Mass Production and Multi-Year Revenue Stream

The project will see Key ASIC deliver a cutting-edge AI chip within 6 to 9 months, followed by volume production — unlocking significant recurring revenue potential. Designed with a minimum 5-year product lifespan, this AI chip will form the backbone of smart products set to transform industries globally.

Ultra-Low Power, High Performance — The Future of AI Chips

The AI chip is engineered to deliver exceptional performance at ultra-low power consumption, addressing one of the most critical demands in AI and Edge computing: maximizing computing power while minimizing energy usage.

"Our strength lies in delivering exactly what the AI market needs — high-performance, ultra- low power chips that enable smarter, faster, and more energy-efficient devices," said Eg Kah Yee, Chairman of Key ASIC. "This deal reflects the trust leading tech leaders place in Key ASIC's design capabilities and positions us at the forefront of AI innovation."

Highlights of the Deal

✔ RM13.1 million secured design revenue, with short delivery cycle

✔ Mass production to follow — unlocking multi-year recurring revenue

✔ AI chip with 5+ year product lifespan, ensuring sustained demand

✔ Ultra-low power, high-performance design — ideal for Edge AI, IoT, and smart devices

✔ Strong foothold in booming global AI and IoT semiconductor markets

✔ Reinforces Key ASIC as a go-to design partner for global tech leaders

Powering the AI-Driven Future

With AI and IoT reshaping industries — from smart cities and intelligent infrastructure to healthcare, automation, and consumer devices — the demand for energy-efficient, high- performance AI chips has never been higher.

Key ASIC’s expertise in advanced chip design, AI acceleration, and ultra-low power architectures uniquely positions the company to capture significant market share in this explosive growth sector.

Key ASIC is again leading the market by “Building the Brains Behind the AI Revolution.”

(Kuala Lumpur, 17 June 2025)

Key ASIC Berhad, a leader in ASIC design services, today announced the launch of its revolutionary AI + IoT SoC platform Synexis™, purpose-built for Edge AI applications that demand real-time intelligence and robust connectivity.

This next-generation SoC platform is the first AI and IoT SoC platform offered in the world to the market. Synexis™ marks a pivotal advancement in enabling smart devices—from industrial automation and healthcare systems to smart homes and wearables—to process AI workloads locally while staying seamlessly connected to the cloud or edge nodes.

To accelerate time-to-market and maximize performance, Key ASIC has developed the necessary IP for the platform to empower the integration of cutting-edge AI processors, neural network engines, and low-power connectivity into a unified, highly efficient SoC architecture— significantly reducing development time and complexity.

“Edge AI plus IOT is not just the future—it’s the now,” said Eg Kah Yee, Chairman and CEO of Key ASIC. “We have designed and implemented 2 generations of AI SoC for our customers in the past. With this AI + IoT SoC platform, we’re equipping innovators with the tools to deliver intelligent, connected experiences at the edge. Our SoC platform enables designers to significantly accelerate our customers' innovation cycles with world-class silicon solutions.”

Driving the Convergence of AI and IoT

The next generation of AI chips must go beyond raw processing power. They must connect, sense, and respond to the real world—which is why IoT technology is essential to the future of AI at the edge. IoT connectivity allows AI chips to collect real-time data from sensors and devices, make on-device decisions, and communicate with other systems, all while minimizing latency, power consumption, and reliance on cloud computing.

AI devices that require seamless IoT integration include:

Smart cameras for surveillance, traffic, and retail analytics

AI-enabled wearables for health monitoring and fitness tracking

Home automation hubs that recognize voice, gestures, and environmental data

Industrial robots and predictive maintenance systems

Smart meters and sensors in energy and environmental monitoring

Connected medical devices for diagnostics and patient care

These applications demand SoCs that are not only intelligent but also energy-efficient, secure, and always connected—a challenge Key ASIC addresses with this integrated platform.

Underscoring its leadership in this space, Key ASIC holds over 10 patents in IoT technologies, covering innovations in low-power design, connectivity protocols, and system-level edge integration.

Key Features of the AI + IoT SoC Platform:

Integrated AI engines for high-performance edge inference and neural processing

ARM-based CPU cores supporting versatile compute tasks

Ultra-low-power wireless connectivity (e.g., Wi-Fi, BLE) for real-time communication

Advanced security features to protect data and ensure trust in edge environments

Scalable architecture, optimized for advanced nodes at 5nm and below

With a growing demand for intelligent, energy-efficient, and connected devices, the platform is ideally suited for OEMs, ODMs, and developers building edge AI solutions across a broad spectrum of industries.

Early access kits for selected customers and design partners will be available starting Q3 2025, with commercial availability expected in early 2026.