(Kuala Lumpur, Malaysia)– October 14, 2015 – KeyASIC Berhad, announces its USB3.0 Device PHY and USB3.0 Device Controller that have been certified by USB-IF since July/2015 (TID: 340000140) to the market in an effort to strengthen its offering in the IOT solution.


Key ASIC will license the USB3.0 IPs to any chip design companies and will also provide a complete ASIC design service with this IP. Revenue will be generated from the licensing of IPs as well as design services and the sales of packaged chips with USB3.0.


It is reaching 3 billion units of USB enabled devices shipped each year and is expected to continue to grow with the rapid growth of IOT devices. Capturing a fraction of this market in the IOT devices would mean a future revenue boost for the company.


Its USB3.0 PHY has passed the Super Speed of 5 Gigabit per second on 0.13u process technology which is extremely challenging. A large percentage of the IOT devices are done at 0.18u and 0.13u process technologies.


USB3.0 with microUSB socket is widely used in the fast growing IOT products where the systems do not really demand for high CPU performance but ultra-low power, most of the chips are designed on 0.18u or 0.13u process technology with ultra-low power consumption.


USB with microUSB connector is now the de facto standard charging connector for many mobile and wearable devices in addition to its data transfer function. IOT products with USB such as smart watches, wearable fitness devices such as pulse meter, medical devices such as blood pressure monitors, glucose meters, etc. are fast growing.


It is reaching 3 billion units of USB enabled devices shipped each year and is expected to continue to grow with the rapid growth of IOT devices.


Ability to offer online diagnostic services through the Cloud for the IOT devices or appliance is one of the areas that are fast growing. Household appliances such as air conditioner, factory equipment or machinery and hospital equipment or devices can all be connected to the Cloud for regular online diagnostics on a regular basis. The manufacturers of the equipment can have real time status of the usage conditions of the equipment deployed in the sites.


“IOT devices need more than just USB. It needs WiFi or 3G/4G connection to the Cloud and also a APP-Cloud platform where customers can develop their applications and APP. We offer a complete solution in silicon and system with our SPG Wi-Fi platform with Wi-Fi, APP and K-Cloud, the Cloud platform for IOT applications,” said Kah Yee Eg, Chairman and CEO of KeyASIC. “This will greatly accelerate the time to market for our customers with a total IOT solution offering,” he added.





About KeyASIC : 

KeyASIC is a leader in providing a total solution in Internet of Things (IOT) ranging from chips, system, APP to Cloud delivering customers in the shortest time to market. Additionally, it is also a market leader in providing ASIC design services with its own IP blocks. Key ASIC has offices in Malaysia, Taiwan, Japan and Singapore.


Petaling Jaya, Malaysia – June 16, 2015–KeyASIC Berhad, announces its USB2.0 OTG Physical Layer (typically known USB2.0 OTG PHY) with in-house developed USB2.0 OTG (On-The-Go) controller IP has been certified by USB-IF since May/2015 (TID: 110000014). There are only a total of 21 certified High Speed OTG IP building blocks in the USB-IF Integrators List including those developed by companies for internal use only.


In addition to above USB-IF certification, Key ASIC’sUSB2.0 Device Physical Layer with in-house developed USB2.0 Device controller IP test chip has also been certified by USB-IF since October/2014 (TID: 70000019). It is one of total of 46 High Speed IP building blocks in the USB-IF Integrators List.


Both KeyASIC’s USB2.0 OTG and Device Physical Layer IP are silicon proven on Silterra 0.13-micron logic process, featuring low power consumption and are architected to quickly and easily integrate into any SoCs, as well as to connect seamlessly to Key ASIC’s in-house USB2 controller. KeyASIC’s USB 2.0 OTG and Device Physical Layerand controller IP provide a cost-effective, low-power solution for demanding applications. They offer SoC integrators the advance capabilities and support that exceed the requirements of high-performance designs and implementations.


KeyASIC's USB2.0 OTG and Device Physical Layer IP test chips are now available and the IP has been used in real SoC in silicon.


USB2.0 is the most popular high speed interface that is currently used today. More than 25% of the electronic products have USB. The next wave of rapid growth post PC and smart phone era is in the Internet of Things (IOT) products where the IOT devices are connected to the Cloud. Most of these devices have wireless connectivity to the IP network and are mobile with chargeable battery. USB or micro USB interface is the de facto mean of charging these IOT mobile devices.

“We are currently leading the market with a SoC with Wi-Fi development platform for IOT products and there are a few products that are currently selling in the market. Our USB2.0 IP blocks are an addition to this powerful and comprehensive IOT platform.” said Rosa Lee, the Product Marketing Manager. “We have one of the industry's most robust ultra-low power management systems to dynamically manage the power consumption of, not just the SoC, but the entire system,” she added.


The IOT products are generally mobile and ultra-power.  The computing requirement on the IOT devices are generally not demanding since most of the computing are executed in the Cloud. As such, 0.13u process technology is the most popular choice for IOT products at this moment.






About Key ASIC

Key ASIC is a leading supplier of high-performance, low-power ASIC design and manufacturing services business for consumer, wireless and personal electronic applications. The team has strong design expertise in advanced 28nm, 40nm and 65nm process technologies. In addition, Key ASIC also provides design and manufacturing services in mainstream 28nm, 40nm, 65nm, 90nm, 130nm and 180nm technologies.Key ASIC has offices in Malaysia, Taiwan, Japan and Singapore.